한화이센셜

Business

Circuit Materials focuses on developing key materials for various applications such as FPCB(Flexible Printed Circuit Board) and semiconductor.

Contributes to circuit board
miniaturization and weight reduction
Contributes to miniaturization
and slimming of electronic devices
High degree of freedom in
circuit design
Excellent
chemical resistance
Excellent
impact resistance

Product Structure and Function

Hanwha e-ssential Circuit Materials are produces core materials for flexible printed circuit board (FPCB) based on its proprietary technologies such as polymer design, synthesis, blending, coating, and lamination.

FCCL(Flexible Copper Clad Laminated)
- A film laminated with copper foil serving as wiring (circuit) in FPCB

Coverlay
- A film preventing foreign substances from entering and oxidation caused by FCCL circuits’ exposure to air

Bonding Sheet
- An inter-layer adhesive film for multi-layer lamination of FCCL

Metal Coverlay
- A film for realizing pen functions such as smartphones and tablets

Application

Hanwha e-ssentialCircuit Materials enable the realization of thinner and lighter high-performance electronic devices, such as smartphones, tablet PCs,and automotive electronics, etc., and is used as materials for the precision electronic products and many other applications.

Circuit Materials
- FCCL
- Bonding Sheet
- Coverlay
- Stiffener

FPCB
- Single Sided FPCB
- Multi Layer FPCB
- Double Sided FPCB
- Rigid-Flex PCB

Module
- Camera
- Wireless Charging
- Antenna
- Home/Side Key
- Digitizer
- CVM
- Display

Electronics
- Mobile Phone
- Desktop/Laptop
- Electronic Vehicle
- Home Appliances
- Wearable Device

Application case

Material for FPCB Module

Materials for the FPCB Modules for Smartphones and Wearable Devices

Applied for the high-performance electronic devices such as smartphones for transmitting a large amount of signals.

- As a film-type signal transmission device - Appropriate for miniaturization, weight reduction and slimming of electronic devices
Material for CVM Module

Materials for the EV/HEV Battery Sensing (CVM) Modules

Circuit Materials are utilized as materials for the key electronic components to maintain the stable function of electric vehicles.

CVM module (Cell Voltage Monitoring System): Applied for the system (CVM module, Cell Voltage Monitoring System) which measures whether the voltage of each battery cell installed in an electric vehicle maintains a stable level and triggers an alarm when the pressure is reduced to lower than the standard.
Materials for IC Package Substrates

Material for IC Package Substrates(FCBGA, FCCSP, etc)

Critical material for designing dielectric layers and fine circuits

Developed material utilizing expertise in anti-ion migration, low Dk/Df and high Tg technology

FCCL(Flexible Copper Clad Laminated)

FCCL
- Application
  - Copper-clad laminated film that serves the role of wiring (circuitry) in FPCB
- Features
  - Excellent heat resistance and dimensional stability
  - Superior adhesion and hole processing ability
FCCL for xEV
- Application
  - Copper-clad laminated film for FPCB Cables used in electronics
- Features
  - Excellent heat resistance and dimensional stability
  - Superior adhesion and hole processing ability
  - Exceptional electrical insulation characteristics (Anti-ion migration)
Low Dk/Df FCCL
- Application
  - Copper-clad laminated film that serves the role of wiring (circuitry) in high-speed transmission FPCB
- Properties
  - Excellent heat resistance and dimensional stability
  - Superior adhesion and hole processing ability
  - Exceptional electrical insulation characteristics (Anti-ion Migration)
  - Low dielectric loss (Df = 0.0025)
Low Df LCP FCCL
- Application
  - LCP-based FCCL serving as wiring (circuitry) in high-speed transmission FPCB
- Properties
  - Excellent dimensional stability
  - Low moisture absorption (<0.04%)
  - Low dielectric loss
    G-grade (Df < 0.002) / S-grade (Df < 0.001)

Coverlay

Coverlay (plain + colored)
- Application
  - Foreign substance/oxidation prevention and insulation film for the exposed surface of the FCCL circuit
- Properties
  - Excellent heat adhesion, flame retardancy, and flexibility
  - Outstanding electrical insulation and filling properties
  - Available in Yellow, White, and Black colors
Anti-ion migration Coverlay
- Application
  - Oxidation/insulation film for the exposed surface of the micro FPCB FCCL circuit (Line Space 25㎛/30㎛)
- Properties
  - Excellent heat resistance and fine circuit filling capacity
  - Excellent flame retardancy and flexibility
  - Excellent electrical insulation properties (Anti-ion Migration)
  - Available in Yellow & Black colors
High Bendable Coverlay
- Application
  - Oxidation/insulation film for the exposed surface of the Foldable FCCL, which requires flexibility
- Properties
  - Product specialized for heat resistance and flexibility
  - Excellent electrical insulation properties (Anti-ion Migration)
  - High modulus and excellent mechanical strength
  - Available in anti-ion & low-dielectric types
Coverlay for xEV
- Application
  - Oxidation/insulation film for the exposed surface of the FCCL for electronic components, requiring high reliability
- Properties
  - Product specialized for heat resistance and long-term reliability
  - Excellent electrical insulation properties (Anti-ion Migration)
  - Available as Polyimide & PEN Film types
  - Available in Hot Press & Quick Press types
Low Dk/Df Coverlay
- Application
  - Minimizing signal loss and providing oxidation/insulation protection for the exposed surface of high-frequency FCCL
- Properties
  - Excellent heat resistance and filling properties
  - Outstanding electrical insulation properties (Anti-ion Migration)
  - Low dielectric loss
    Olefin Type (Df < 0.003) / Modified PI Type (Df < 0.004)

Bonding Sheet

Bonding Sheet
- Application
  - Interlayer adhesive film for multiple stacking of FCCL
- Properties
  - Excellent heat resistance and chemical resistance
  - Excellent accessibility and hole processability
  - Excellent punchability and hole workability
Anti-ion migration Bonding Sheet
- Application
  - Interlayer adhesive film for micro-multilayer FPCB FCCL circuit (Line Space 25㎛/30㎛)
- Properties
  - Excellent heat resistance and chemical resistance
  - Excellent hole processability and crack resistance
  - Low moisture absorption rate and low discoloration
  - Outstanding electrical insulation properties (Anti-ion Migration)
Low Dk/Df Bonding Sheet
- Application
  - Low-loss interlayer adhesive film for wiring (circuit) lamination of high-speed transmission FPCB
- Properties
  - Excellent heat resistance and chemical resistance
  - Outstanding electrical insulation properties (Anti-ion Migration)
  - Low dielectric loss
    Olefin Type (Df < 0.0025) / Modified PI Type (Df < 0.0035)
  - Modified PI Type: Excellent LVH processability
Low Dk/Df Bondply
- Application
  - Low-loss interlayer adhesive film for wiring (circuit) lamination of high-speed transmission FPCB
- Properties
  - Excellent heat resistance and chemical resistance
  - Outstanding electrical insulation properties (Anti-ion Migration)
  - Thick low-dielectric adhesive film (>70㎛)
High Dk Bonding Sheet
- Application
  - Interlayer adhesive film for circuits requiring integration and high dielectric constant Features
- Features
  - Excellent heat resistance and chemical resistance
  - Outstanding electrical insulation properties (Anti-ion Migration)
  - Implementation of High Dk & Low Df (Dk 6.0, Df 0.006)
  - Implementation of Ultra High Dk (Dk > 15)